SK hynix e-NAND Product Family eMMC5.1 Compatible

Table of Contents

1. Introduction ................................................................................................................. 4

1.1 General Description ............................................................................................................................................................. 4

1.2 Product Line-up ................................................................................................................................................................. 4

1.3 Key Features ...................................................................................................................................................................... 4

2. Package Configurations ................................................................................................ 5

2.1 Pin connection .................................................................................................................................................................... 5

2.2 Package Mechanical Drawing ............................................................................................................................................... 7

3. e-NAND Characteristics ............................................................................................... 9

3.1 Performance ..................................................................................................................................................................... 9

3.2 Power .............................................................................................................................................................................. 10

4. e-NAND new features (eMMC5.0 and eMMC5.1).......................................................... 12

4.1 eMMC5.0 New features............................................................................................................................................ 12

4.1.1 HS400 mode .................................................................................................................................................................. 12

4.1.2 Field firmware update ..................................................................................................................................................... 19

4.1.3 Health(Smart) report ...................................................................................................................................................... 22

4.1.4 Production state awareness ............................................................................................................................................. 23

4.1.5 Sleep notification ............................................................................................................................................................ 25

4.1.6 Secure removal type ....................................................................................................................................................... 26

4.2 eMMC5.1 New features............................................................................................................................................ 27

4.2.1 Command queuing ......................................................................................................................................................... 27

4.2.2 Cache barrier ................................................................................................................................................................. 31

4.2.3 Cache Flushing report ..................................................................................................................................................... 33

4.2.4 Background operation(BKOP) control ............................................................................................................................... 33

4.2.5 Secure Write Protection .................................................................................................................................................. 34

4.2.6 Enhanced strobe ............................................................................................................................................................ 39

4.2.7 RPMB throughput improvement ....................................................................................................................................... 43

5. e-NAND general parameters ....................................................................................... 44

5.1 Timing ............................................................................................................................................................................. 44

5.2 Bus signal ......................................................................................................................................................................... 49

5.3 Power mode ..................................................................................................................................................................... 53

5.4 Connection guide .............................................................................................................................................................. 57

6. e-NAND basic operations ............................................................................................. 58

6.1 Partitioning ....................................................................................................................................................................... 58

6.2 Boot operation .................................................................................................................................................................. 61

7. Timeout ....................................................................................................................... 62

8. Register ....................................................................................................................... 64

8.1 Operation conditions register (OCR) .................................................................................................................................... 64

8.2 Card identification (CID) register ......................................................................................................................................... 65

8.3 Card specific data register(CSD) ......................................................................................................................................... 65

8.4 Extended CSD register ....................................................................................................................................................... 68

8.5 RCA (Relative Card Address) ............................................................................................................................................... 74

8.6 DSR (Driver Stage Register) .............................................................................................................................................. 74

Rev 1.6 / Jul. 2016 3

Rev 1.6 / Jul. 2016 4

1. Introduction

1.1 General Description

SK hynix e-NAND consists of NAND flash and MMC controller.

e-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage col

lection, and ECC. e-NAND protects the data contents from the host sudden power off failure.

e-NAND is compatible with JEDEC standard eMMC5.1 specification.

1.2 Product Line-up

1.3 Key Features

• eMMC5.1 compatible

(Backward compatible to eMMC4.5&eMMC5.0)

• Bus mode

- Data bus width : 1bit(default), 4bits, 8bits

- Data transfer rate: up to 400MB/s (HS400)

- MMC I/F Clock frequency : 0~200MHz

- MMC I/F Boot frequency : 0~52MHz

• Operating Voltage Range

- Vcc (NAND) : 2.7V - 3.6V

- Vccq (Controller) : 1.7V - 1.95V / 2.7V ~ 3.3V

• Temperature

- Operation (-25℃ ~ +85℃)

- Storage without operation (-40℃ ~ +85℃)

• Others

- This product is compliance with the RoHS directive

Density

Part Number

NAND Stack

PKG Size (mm)

Package Type

8GB H26M41208HPR 64Gb x 1 11.5x13x0.8

153FBGA

16GB H26M52208FPR 64Gb x 2 11.5x13x0.8

32GB H26M64208EMR 64Gb x 4 11.5x13x1.0

64GB H26M78208CMR 64Gb x 8 11.5x13x1.0

• Supported Features

- HS400, HS200

- HPI, BKOPS, BKOP operation control

- Packed CMD, CMD queuing

- Cache, Cache barrier, Cache flushing report

- Partitioning, RPMB, RPMB throughput improve

- Discard, Trim, Erase, Sanitize

- Write protect, Secure write protection

- Lock/Unlock

- PON, Sleep/Awake

- Reliable Write

- Boot feature, Boot partition

- HW/SW Reset

- Field Firmware Update

- Configurable driver strength

- Health(Smart) report

- Production state awareness

- Secure removal type

- Data Strobe pin, Enhanced data strobe

(Bold features are added in eMMC5.1)

Rev 1.6 / Jul. 2016 5